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Gov. Andrew Cuomo, in his first State of the State speech on Tuesday, signaled his plan to turn New York into the country’s next drug-pricing experiment, and he made it clear that drug makers will not be on equal footing.
The governor’s plan will place the drug companies, which have long had pricing power, in a position where they will be outspent by any city or state that wants to negotiate with them, and they will have little choice but to cut prices, he said.
Cuomo offered no details on how his plan would be paid for. But he said that he wants to ask the Legislature to pass a “fair and affordable drug pricing” bill.
“We need to pass a fair and affordable drug pricing bill. A bill that does more than just authorize us to negotiate,” he said. “We need to pass a fair and affordable drug pricing bill to actually put our offer on the table to our pharmaceutical companies.”
Cuomo, whose plan would be the first major reform of the nation’s so-called patent system since the creation of the drug industry, said he would “write the prescription for our own next great experiment in economic development.”
In his State of the State address, which begins a six-year legislative session, he also outlined what he called “a
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Leopard’s Sex and the city (Tutti i Torrent delle 6 stagioni) 4Tvrip — Nero 2 In Dvdrip Dts Aac — CdуTorrent Search Engine.This invention relates to a method for terminating electroconductive circuit elements. More particularly, the invention relates to a method for forming a contact and a barrier layer without thermal heating and mechanical interference. The invention is most effectively applicable to the formation of contact openings in an interlevel dielectric layer of a semiconductor device and is therefore described below with respect to such a contact opening.
In the manufacture of semiconductor devices, for example, memory and other integrated circuits, various circuit elements, such as transistors, capacitors and conductive patterns, are formed into or over a semiconductor substrate, such as silicon. Typically, electrical connections between these circuit elements are formed by a process called metallization. For instance, multiple metallization levels are used to interconnect the circuit elements formed in and over the various layers of the semiconductor substrate.
Generally, the different metallization levels are separated by a dielectric layer. Interlevel dielectric material, that is, dielectric material lying between the previously deposited metallization levels, can be used to insulate or separate circuit elements. As is well known in the art, metal barriers, such as titanium nitride (TiN), are deposited at the interface between the dielectric layer and the previously deposited metal layers to prevent the diffusion of the previously deposited metals into the dielectric layer. For instance, the previously deposited metal layers can include aluminum (Al
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